The effect of chemical-mechanical processing of silicon wafers on their surface morphology and strength

The mechanical strength of various silicon wafers with a thickness 100 μm has been studied, depending on the methods their preparation and modes subsequent grinding or polishing, including chemical-mechanical (HMP). plates were loaded using ring-to-ring method, magnitude stresses deflection under small ring was determined by finite element method. For all samples profiles roughness parameters obtained stylus profilometry atomic force microscopy (AFM) when scanning surface along baseline over area. A direct correlation found between characteristic profile (the average values period fluctuations in height irregularities). Keywords: wafer, strength, polishing treatment, morfology.